Fast movement strategies for a step-and-scan wafer stepper
نویسندگان
چکیده
We describe algorithms for the determination of fast movement strategies for a step-and-scan wafer stepper, a device that is used for the photolithographic processing of integrated circuits. The proposed solution strategy consists of two parts. First, we determine the maximum number of congruent rectangular chips that can be packed on a wafer, subject to the restriction that the chips are placed in a rectangular grid. Second, we find fast movement strategies for scanning all chips of a given packing, given the mechanical restrictions of the wafer stepper. The corresponding combinatorial optimization problem is formulated as a generalized asymmetric traveling salesman problem. We show how feasible scan strategies are determined, and how these strategies are improved by local search techniques, such as iterative improvement based on 2and 3-exchanges, and simulated annealing based on 2-exchanges.
منابع مشابه
Control Relevant Identi cation and Robust Motion Control of a Wafer Stage
This chapter illustrates the identi cation of control-relevant models and the subsequent robust control design applied to a wafer stage. A wafer stage is part of a wafer stepper and used in chip manufacturing processes for accurate positioning of the silicon wafer on which the chips are to be produced. Accurate and fast positioning requires a robust and high-performance multivariable servo cont...
متن کاملDynamic Simulation of a Novel Hybrid Linear Stepper Motor by Means of Matlab/simulink®
The main advantage of linear motors is that they do not turn the electric energy supplied into a rotary movement, but convert it directly to a linear movement. The direct coupling of the mover armature to the load provides several performance benefits in addition, as high speeds, high precision, no backlash, high stiffness and fast response and settling times. In these circumstances it is inter...
متن کاملAn Automated Method for Overlay Sample Plan Optimization
In this paper, we present an automated method for selecting optimal overlay sampling plans based on a systematic evaluation of the spatial variation components of overlay errors, overlay prediction errors, sampling confidence, and yield loss due to inadequate sampling. Generalized nested ANOVA and clustering analysis are used to quantify the major components of overlay variations in terms of st...
متن کاملOptimization of through Si via Last Lithography for 3d Packaging
In this paper we optimize the back-to-front overlay of Through Silicon Via (TSV) patterning for a 5μm via last process. After TSV patterning, overlay verification poses a challenge because the reference layer is buried underneath the thinned silicon wafer. For both back-to-front alignment and verification a wafer stepper equipped with a Dual Side Alignment (DSA) system is used. The stepper has ...
متن کاملFour-step pulses of fractional-order surface plasmons.
The 0-order transmission of a 1D metallic grating, on a high-resistivity silicon wafer in optical contact with a silicon plate, has been characterized by terahertz time-domain spectroscopy with subpicosecond resolution over a 400 ps scan range. Two new long-time-delay, powerful pulses are observed after the second reflected pulse. In the frequency domain, these two strong and fast-ringing struc...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 1997